General chair

TPC Chair

Local Organizing Committee

Technical Program Committee

• Adrijan Barić, University of Zagreb, Croatia
• Alexandre Boyer, LAAS-CNRS, France
• Andre Durier, Continental, France
• Bart Boesman, Melexis, Belgium
• Bernd Deutschmann, Technical University of Graz, Austria
• Bertrand Vrignon, NXP, France
• Binhong Li, Institute of Microelectronics of Chinese Academy of Sciences, China
• Bob Scully, NASA Johnson Space Center, USA
• Davide Pandini, ST Microelectronics, Italy
• Davy Pissoort, KU Leuven Bruges, Belgium
• Erica Raviola, Politecnico di Torino, Italy 
• ErPing Li, Zhejiang University, China
• Etienne Sicard, INSA Toulouse, France
• Fabian Vargas, PUCRS, Brazil
• Franco Fiori, Politecnico di Torino, Italy
• Frank Klotz, Infineon, Germany
• Frederic Lafon, Valeo, France
• HarkByeong Park, Samsung, South Korea
• Hugo Pues, Melexis, Belgium
• Hyun Ho Park, The University of Suwon, South Korea
• Jack Kruppa, Infineon, Germany
• Jan Niehof, NXP, Netherlands
• Jean-Michel Redoute, Universit y of Liege, Belgium
• Jeremy Raoult, Montpellier University, France
• Jianfei Wu, NUDT, China
• Kieran O’ Leary, Mixed Signal Systems, United Kingdom
• Kamel Abouda, NXP, France
• Makoto Nagata, Kobe University, Japan
• Mart Coenen, EMCMCC, Netherlands
• Masahiro Yamaguchi, Tohoku University, Japan
• Mauro Merlo, ST Microelectronics, Italy
• Mohamed Ramdani, ESEO Angers, France
• Mototsugu Okushima, Renesas, Japan
• Osami Wada, Kyoto University, Japan
• Ramiro Serra, TU Eindhoven, Netherlands
• Richard Xian-Ke Gao, Institute of High Performance Computing A*STAR, Singapore
• Renaud Gillon, SYDELITY, Belgium
• Richard Perdriau, ESEO Angers, France
• Seungyoung Ahn, KAIST, Korea
• Sergey Miropolsky, Infineon, Germany
• Shih-yi Yuan, Feng Chia University, Taiwan
• Sonia Ben Dhia, LAAS-CNRS, France
• Umberto Paoletti, Hitachi Ltd., Japan
• Wolfgang Wilkening, Bosch, Germany