Courtesy of Open Circuits: The Inner beauty of Electronic Components

EMC COMPO is a unique event attracting experts on the electromagnetic compatibility of integrated circuits and modules from all over the world.

Aiming at exchanging experience among fellow professionals and academics, and bearing in mind the role of electronic components in terms of electromagnetic compatibility, safety and reliability of electronic modules and systems, EMC COMPO 2024 is the right place to achieve this goal. EMC COMPO in Torino will provide the opportunity to discuss hot topics through oral, poster sessions and tutorials.


Technical papers are solicited on any subject pertaining to the scope of the workshop including, but not limited to, the following major topics.

Susceptibility to EMI of analog and mixed signal ICs

  • Amplifiers
  • Active filters
  • ADC and DAC
  • Oscillators and PLLs
  • ASICs for analog and digital sensors
  • Power output stages and I/Os
  • ESD/EOS protection

EMC of analog and digital sensors

  • Resistive, Capacitive and Temperature sensors
  • Accelerometers, Gyroscopes
  • Pressure sensors
  • Acoustic and Ultrasonic Sensors

EMC issues in ICs

  • EMC of ICs for wireline communications
  • EMC of ICs for wireless communications
  • EMC-aware Design of ICs and Guidelines
  • Issues in System-on-chip (SoC), System-in-Package (SiP), and 3D ICs
  • Long term electromagnetic robustness of ICs
  • Substrate coupling in smart power ICs.

Electromagnetic emission of  core blocks and I/Os

  • Core logic cells
  • Power supply decoupling
  • Line drivers (CAN, LIN, FlexRay, Ethernet)

Signal and Power integrity

  • Interconnects, Modeling
  • Characterization, Crosstalk, Jitter, Noise
  • Signal Integrity and Power Integrity at IC and PCB level
  • EMC issues in System-on-chip (SoC), System-in-Package (SiP), and 3D ICs
  • Tools to handle EMC at IC and module level

Measurement methods for chip level EMC analysis 

  • Conducted and radiated emission of ICs
  • Surface scanning techniques
  • Susceptibility to RF interference
  • Susceptibility to pulsed interference (ESD, BURST, SURGE)

Materials for improved EMC of ICs

  • Shielding of IC packages
  • Magnetic composite sheets

Power electronics EMC/EMI

  • SiC and GaN-based power converters with reduced EMI
  • Power modules based on WBG (SiC and GaN) devices
  • Power and Signal Integrity in power modules
  • Parasitics optimization at the PCB and hybrid module level
  • Passive and active EMI filters analysis and design
  • Integration of EMI filters: material, component design, and implementation
  • Gate driver design for EMC compliance
  • Oscillation free design
  • Symmetric paralleling of power semiconductors
  • Wide bandwidth integrated current and voltage sensors

EMC Challenges for Passive components

  • Capacitors and dc-links
  • Magnetic components (ferrite, chokes, …)
  • High frequency modeling of passive components

EMC Standards and regulations

  • Conducted emission IEC61967
  • Immunity CW IEC62132
  • Radiated emission SAE J1752

Modeling for EMC

  • Behavioral modeling for EM emissions of ICs
  • Behavioral modeling for EM susceptibility of ICs
  • Evaluation of EMC risk
  • IMIC and ICEM models
  • Nonlinear modeling
  • Substrate coupling

EMC of ICs and SoCs for biomedical applications

  • Microfluidics and Biosensors
  • Chemical and Molecular Biosensors
  • Integrated systems for wearable healthcare
  • Hearing aid and cochlear implant
  • ICs for cardiac rhythm managment
  • Artificial retina ICs

Influence of IC EMC on system design

  • Automotive and Aerospace applications
  • ICs with robust ESD design
  • EMC techniques in design of IC chips for hardware security